|
Characteristics
|
RAINSUN LTCC |
|
Dielectric Constant (@2.14GHz, 25℃ ) |
7.8 |
|
Dissipation Factor ( @2.14GHz,25℃ ) |
0.34％ |
|
Temperature Coefficient of Resonant Frequency (Tf) |
-8.9 |
|
Thermal Expansion (TCE) (ppm/℃) (25-300℃) |
4.6 |
|
Thermal co-efficient of capacitance (TCC) (-48~80℃) |
8.6 |
|
|
>0.05mm |
|
Substrate Dimension Tolerance |
<0.6％ |
| Number of Layers | Depend on design |
| Insulation resistance @ 100Vdc | >1×10E12 0hm |
Chief Up LTCC
Green Tape Design Rule
|
|
Standard (mm) |
Advanced (mm) |
|
(A) Via Diamenters |
0.12, 0.15, 0.2 |
0.1 |
|
(B) Catch Pad Diameters |
Via + 0.05 |
Via + 0.02 |
|
(C) Via Center Spacing |
0.25 for 0.12 via |
0.18 for 0.1 via |
|
(D) Line Edge to Pad Edge |
>0.10 |
>0.05 |
|
(E) Line Width |
>0.1 |
>0.05 |
|
|
>0.1 |
>0.05 |
|
(G) Line over Outside Edge for Cutting |
>0.1 |
>0.05 |
| (H) Outside Edge to Via Center | >0.25 | >0.125 |
| (I) Outside Edge to Line Clearance | >0.2 | >0.1 |
| (J) Buried Ground Plancing | >0.2 | >0.1 |
|
(K) Feed Thru Spacing |
>0.1 | - |