Features of the ViaCon® Systems
Detection of all typical defects with separate tolerance settings
Inspection of 50,000 or more vias in one 8 inch sheet in about 10 seconds
Via diameters range from 50 µm up to 5 mm
Sheet thickness up to 500 µm
Detection of "hidden" particles
ViaCon® is no surface scanner
ViaCon® is a backlight scanner
Easy user interface (GUI)
Visually guided analysis of defects
Visual analysis of statistical data
All ViaCon® Systems support worldwide
Remote administration for best support
Available as inline or stand-alone systems
| Typical defects in punched ceramic sheets | |
| Defect | Cause(s) |
| missing via |
- pin break
|
|
completely or partly clogged vias -remains, debris particles- |
- worn punch
pin / bushing
|
| wrong via size / diameter errors |
- layout data
error
|
| Bad via shape quality |
- worn punch pin / bushing
|
|
Bad via position -local misplacement of one vias- -global offset of many vias- |
- wrong
machine or process set-up
|
|
wrong sheet size ripped, torn or cracked sheet |
- wrong sheet production
|
Advantages of an early 100% defect detection
Bad products are sorted out
No further processing of bad products
COST REDUCTION
Computer aided defect analysis with statistics
Process optimisation
Direct process feedback
Faster problem solutions, lower downtimes
Higher yield, COST REDUCTION
Analysis and statistics of all inspected products
See
problems before defects appear (tendencies)
Pre-defect detection of used wearing parts
Change wearing parts only, when really necessary
COST REDUCTION
Repair (rework) support
Lower waste rate
Higher yield, COST REDUCTION
Highly automated inspection, easy operation
One operator for several running machines
COST REDUCTION
No human influence
Constant inspection quality level, 24 h per day
No workers needed for inspection
Secure, reliable production, COST REDUCTION
For more information, please contact us. We are able to provide the product to meet exactly what you need.