Automatic plating machine for chip R/ chip C/ chip I
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Fully automation
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PC control system
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| Rectifier | Tank |
Typical plating process
|
|
Tank amount |
Tank size (inside dimensions; mm) |
|
(A) Cleaning chips by acidic liquid |
1 |
800*500*500 |
|
(B) Rinsing chips by D.I. water |
1 |
800*500*500 |
|
(C) Nickel plating |
6 |
800*600*500 |
|
(D) Electrolysis treatment |
2 |
800*250*500 |
|
(E) Recycle |
1 |
800*500*500 |
|
(F) Exchange |
1 |
800*500*500 |
|
(G) Rinsing chips by D.I. water |
3 |
800*500*500 |
|
(H) Pre-dip treatment |
1 |
800*500*500 |
|
(I ) Tin plating |
6 |
800*600*500 |
|
(J) Electrolysis treatment |
1 |
800*250*500 |
|
(K) Rinsing chips by D.I. water |
3 |
800*500*500 |
|
(L) Ultrasonic clean with hot water |
1 |
800*500*500 (SUS304*3T) |
|
(M) Load / Un-load |
1 |
800*500*500 |
Please contact us for detail information.