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Highly efficient method of capturing and orienting small ship components to
prepare them for the termination and drying stages of chip production. The
silicon rubber plates provide high-density loading of parts for very high volume
chip-processing operation.
Carrier plates are available in a vanity of hole patterns and hole sizes that
are matched to the chip dimensions.
Epically, the plates are custom fit to each chip size to provide a secure
holding force on the loaded chips. Tight termination end width and registration
control and superior cosmetic appear-ance of the parts can be attributed to the
uniform positioning of the chips in the pastes.
The plates can carry as many as 7370 parts and can accommodate miniature parts.
such as 0201 (0503 metric), in special small round hole patterns. High-volume
handling of standard part sizes (such as 0603. 0805. etc.) is accomplished with
various round hole patterns.
The plates are made of aluminum and silicon rubber. Our extensive experience and
research with various silicon rubber hybrids have resulted in the ability useful
life of over 3000 termination and drying cycles. This is equivalent to over
million terminated chips for a plate with a 7370 hole pattem.
The rubber composition can withstand 200oC(392oF)during
the oven-drying cycle. Optimum life and wear reduction are achieved when using
an actual temperature range of 150oC-165oC ( 302oF
- 329oF), measured at the plate surface
Maintenance of the plates is minimal, with cleanliness being the primary
concern.
Our carrier plates have been used successfully to handle a wide variety of chip
components, such as the following:
Multiplayer ceramic capacitors
Chip array devices
Surface-mount chip thermistors
Multiplayer chip varistors
Multiplayer chip inductors
M.E.L.F.'s
Tubular ceramic fuses
Chip resistors (5-side termination)
Piezoelectric actuators
Ceramic spacers and grommets
Piezoelectric transducers
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Product:
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Carrier Plate | ||||
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Appearance specification:
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size is "ft"
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Specification:
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aperture 7370, 6048, 5301, 4233, 1904, 608, for detailed specification, please refer to the attachment. | ||||
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Major customers:
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Taiwan, Japan, Korea, Mainland China, England, Malaysia and other areas | ||||
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Instruction:
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To protect the benefit of users of the dipping machine, we have invested to produce high quality silicon plate of aesthetic appearance and more inexpensive price coupled with fast delivery. We expect to help customers with higher quality and lower production cost, accessing to success together. CHIP test offered is better and more accurate for aperture diameter. | ||||
| * Smart Carrier Plate is being developed, can develop automatic termination dipping and drying systems. | |||||
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Specification
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Specification
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Specification
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Specification
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Specification
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Specification
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7370-28
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6048-17
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5301-31
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4233-38
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1904-75
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608-135
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7370-30
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N6048-18
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5301-33
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4233-40
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1904-79
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608-140
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7370-31
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O6048-18
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5301-35
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4233-42
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1904-84
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608-146
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7370-33
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6048-20
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5301-38
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4233-44
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1904-89
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608-150
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7370-35
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5301-40
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4233-45
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1904-95
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608-155
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7370-38
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5301-42
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4233-46
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1904-100
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608-192
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7370-40
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5301-44
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4233-48
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1904-105
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608-198
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7370-42
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5301-45
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4233-50
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1904-110
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608-205
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7370-44
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5301-46
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4233-52
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1904-115
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608-265
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7370-45
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5301-48
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4233-55
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1904-120
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7370-46
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5301-50
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4233-60
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1904-125
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7370-48
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5301-52
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4233-62
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1904-130
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7370-50
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5301-55
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4233-65
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1904-132
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5301-57
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4233-68
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1904-135
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5301-60
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4233-70
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5301-62
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4233-73
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5301-65
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4233-75
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SP-1904(120mil) |
SP-1904(120mil) |
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SP-4233(60mil) |
SP-6048(20mil) |